HUAIN Wired Conference Microphone System Discussion Dual Diaphragm Pickup HY-6210C HY-6210D HY-6210CK HY-6210DK

DSP/DDOV technology

- Advanced and stable “IRIN” chip, DSP/DDOV digital conference technology, digital signal transmission and processing;

Intelligent audio detection

Dual backup design

- Extendable to support hand in hand meeting and phantom power dual system audio signal output at the same time, can double guarantee audio signal;

Pickup Stencil Design

- Zinc-aluminum alloy microphone pole, unique cavity and one-piece pickup stencil design, can accurately control the pickup angle, to avoid acoustic feedback and whistling, to support the dual-pickup head lateral array technology;

Zinc alloy body

- All zinc alloy body, base finishing one-piece molding, anodic oxidation process;

Multiple connection methods

- Support one-line, splitter box, T-head and ring handrail and other connection methods, comes with a professional 8-core or CAT5 cable, the wire using the whole line of aluminum foil, water line shielding, can effectively avoid and prevent line electromagnetic interference;

4 conference modes

- Through the PC conference management software to support the application to speak mode, queuing mode, the computer allows mode, speaking time limit mode

Super anti-interference ability

- With super anti-interference ability, it can effectively isolate cell phones, radio waves, Bluetooth, WiFi and other signal interference, and never produce noise when calling;