Desktop Capacitive Conference Unit Professional Conference Solution System HY-620D

Model: HY-620DA Conference Unit

Adopting digital DSP audio processing chip conference technology to realize digital signal transmission and processing; 
The base is made of high-quality zinc alloy processing one-piece molding, the surface has no seams, no screw holes;

DSP/DDOV technology

- Advanced and stable “IRIN” chip, DSP/DDOV digital conference technology, digital signal transmission and processing;

Intelligent audio detection

Antistatic design

- Simple and steady countertop strong anti-static function design, ergonomic, extremely modern sense of technology;

- Full zinc alloy body, base finishing one-piece molding, anodic oxidation process;

MICROPHONE

- Microphone connector and all studs are made of pure copper, restore sound quality, ensure quality stability and ensure pickup distance and sound quality;

Audio transmission technology

- High-fidelity lossless audio transmission technology, 48KHz audio sampling frequency, sensitive pickup, clear voice, frequency response up to 30Hz-20KHz;

Static isolation technology

-Adopted advanced static isolation technology design, even in dry environments and areas can be avoided to generate static electricity;

Strong anti-interference technology

- Adopting digital strong anti-interference technology to ensure that the equipment in the venue is not interfered by cell phones, Bluetooth, radio, WiFi and other signals;